The Au/Ni/Cu interfaces in the joints with a solder ball diameter of... | Download Scientific Diagram
a) Au-Sn binary phase diagram; (b) SEM image of the AuSn TLP bond;... | Download Scientific Diagram
Reliability analysis of Au–Sn flip-chip solder bump fabricated by co-electroplating
Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging | SpringerLink
Materials | Free Full-Text | Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders
Thermodynamic reassessment of Au–Ni–Sn ternary system - ScienceDirect
Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications - Lee - 2016 - Surface and Interface Analysis - Wiley Online Library
Metals | Free Full-Text | Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics
a) Interface of Cu/SnAg in Au/Ni/Cu-SnAg-Cu solder joint after aging... | Download Scientific Diagram
The Microstructure of Eutectic Au-Sn and In-Sn Solders on Au/Ti and Au/Ni Metallizations during Laser Solder Bonding Process for Optical Fiber Alignment | Semantic Scholar
THE MICROSTRUCTURE OF EUTECTIC AU-SN SOLDER BUMPS ON CU/ELECTROLESS NI/AU
Variation of the composition of the complex IMC (Au,Ni,Cu) Sn layer... | Download Scientific Diagram
Metalized Ceramic Substrate with AuSn/AG/Cu/Ni/Sn/Au - China Ceramic Substrate with Ausn/AG/Cu/Ni/Sn/Au and Metalized Aln Ceramic Substrate
Investigation of the interfacial reactions and growth behavior of interfacial intermetallic compound between Sn37Pb solder and A
Figure 3 from Effect of Ni on the Formation of ${\hbox {Cu}}_{6}{\hbox {Sn}}_{5}$ and ${\hbox {Cu}}_{3}{\hbox {Sn}}$ Intermetallics | Semantic Scholar
UPA Compu-Derm-B Data Card Sn-Pb/Cu 49. Millionths With Au/NI NNi Stan – Maverick Industrial Sales
Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump | SpringerLink
Experimental Determination of the Sn-Cu-Ni Phase Diagram for Pb-Free Solder Applications | SpringerLink
Kinetics of reactive diffusion in the (Au–Ni)/Sn system at solid-state temperatures - ScienceDirect
Ni-Sn phase diagram. 6 | Download Scientific Diagram
Molex 39-00-0435 Mini-Fit Female Crimp Terminal, Selective Gold (Au) and Selective Tin (Sn) over Nickel (Ni), 22-28 AWG, Bag | Techni-Tool
Improved contact resistance and solderability of electrodeposited Au-Sn alloy layer with high thermal stability for electronic contacts - ScienceDirect
Microstructural evolutions of Cu(Ni)/AuSn/Ni joints during reflow - ScienceDirect
Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method | Semantic Scholar
Comparative study of Au–Sn and Sn–Ag–Cu as die‐attach materials for power electronics applications - Lee - 2016 - Surface and Interface Analysis - Wiley Online Library
